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14320Fakultät 1 – MINT – Mathematik, Informatik, Physik, Elektro- und Informationstechnik
Signal-/Powerintegrität und Elektromagnetische Verträglichkeit
Titel auf Englisch: Signal/Power Integrity and Electromagnetic Compatibility
Lernergebnisse
After successfully completing the module, students will be acquainted with a) root causes of signal integrity (SI), power integrity (PI) and electromagnetic compatibility (EMC) issues in electronic systems, b) basic electromagnetic field and circuit concepts for analysis of SI, PI and EMC issues, especially in electronic packaging for radio frequency (RF) and high-speed systems.
Inhalte
- Introduction to signal integrity (SI), power integrity (PI) and electromagnetic compatibility (EMC)
- Signal distribution networks (SDNs) and power delivery networks (PDNs) in electronic systems
- Role of electronic packaging and heterogeneous integration technologies on signal and power integrity (SIPI) and EMC
- Basic electromagnetic field and circuit theories for SIPI and EMC
- SI: Analysis of single-ended and differential signal paths of SDNs
- PI: Analysis of impedance, inductance and capacitance of PDNs
- EMC: Analysis of coupling and undesired radiation
- EMC & SIPI: Introduction to design methodologies for SIPI and EMC
Voraussetzungen
Verpflichtende Voraussetzungen
Keine
Empfohlene Voraussetzungen
Keine
Prüfungsmodalitäten
- Oral exam, 30-45 min. OR
- Written exam, 90 min.
Angeboten in
- Micro- and NanoelectronicsM.Sc.
Wahlpflichtkomplex: Circuit Design
- PhysicsM.Sc.
Wahlpflichtkomplex: Minor Subject
- ElektrotechnikMaster
Wahlpflichtkomplex: Kein Komplex genannt
| Studiengang | Abschluss | Wahlpflichtkomplex |
|---|---|---|
| Micro- and Nanoelectronics | M.Sc. | Circuit Design |
| Physics | M.Sc. | Minor Subject |
| Elektrotechnik | Master | Kein Komplex genannt |
Literatur und Materialien
- Lecture notes
- Stephen H. Hall, Howard L. Heck: Advanced Signal Integrity for High-Speed Digital Designs, Wiley 2009
- Paul G. Huray: The Foundations of Signal Integrity, Wiley, 2009
- Clayton Paul: Introduction to Electromagnetic Compatibility, Wiley, 2006
- Larry D. Smith, Eric Bogatin: Principles of Power Integrity for PDN Design-Simplified: Robust and Cost Effective Design for High Speed Digital Products, Prentice Hall, 2017
- Madhavan Swaminathan, Ege Engin: Power Integrity Modeling and Design for Semiconductors and Systems, Prentice Hall, 2007
Bewertungen von Studierenden
Was Studierende über dieses Modul sagen. Die BTU hat damit nichts zu tun — hier schreiben nur Studierende, und jede Bewertung ist die Meinung einer einzelnen Person.